Thermal Management & Cooling Technologies
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Microfluidic Pumping Based on Dielectrophoresis
Technology No. 64851
Semiconducting Polymer Blends for High Temperature Organic Electronics
Technology No. 2018-MEI-68125
Software Tool for Calculating Temperature Field of Metal-dielectric Heterojunctions
Technology No. 2015-RUAN-67171
Self-Calibratable MEMS Absolute Temperature Sensor
Technology No. 66274
Free-Particle Boiling Enhancement Technique
Technology No. 66114
Microchannel Heat Sink with Means for Local and Global Heat Transfer Enhancement
Technology No. 64046
Thermally-Stable Nonuniform Microcorrugated Capacitive MEMS Tuner
Technology No. 2015-PERO-67148
Mechanically Robust Copolymer Thin Film for Thermal Interface Material
Technology No. 2024-HOWA-70532
Woven Ribbon Thermoelectric Modules
Technology No. 2018-YAZA-68128
Flash Boiling System for Rapid Cooling of Pulsed Heat Sources
Technology No. 2015-FISH-67229
A Method for Reducing the Sound Radiated by a Fan Mounted to an Enclosure
Technology No. 64313
A Novel Copper Microporous-Assisted Bonding Method for Fine-Pitch Cu/Sn Microbump 3D Interconnects
Technology No. 2024-WEI-70460
Backside Power Distribution in 3D Bonded Circuit
Technology No. 2024-DUNG-70649
Highly Dense and Uniform Copper Nanowires Fabrication for Enhanced Multilayered Thermal Interface Material Application.
Technology No. 2024-WEI-70725
Liquid and vapor separation in liquid jet impingement cooler for low surface tension fluids
Technology No. 2024-WEI-70610
Embedded microchannel cooling in Semiconductor back-end-of-line
Technology No. 2024-WEI-70574
Ultra compact and thin lid integrated impingement multijets manifold for on-chip cooling
Technology No. 2025-WEI-70842
