Thermal Management & Cooling Technologies

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Thermal Management & Cooling Technologies (4)

Highly Dense and Uniform Copper Nanowires Fabrication for Enhanced Multilayered Thermal Interface Material Application.

Technology No. 2024-WEI-70725

Liquid and vapor separation in liquid jet impingement cooler for low surface tension fluids

Technology No. 2024-WEI-70610

Embedded microchannel cooling in Semiconductor back-end-of-line

Technology No. 2024-WEI-70574

Ultra compact and thin lid integrated impingement multijets manifold for on-chip cooling

Technology No. 2025-WEI-70842