Mechanically Robust Copolymer Thin Film for Thermal Interface Material

Thermal interface materials act as a conductor between a heat source and heat sink to facilitate heat dissipation. However, in many applications, temperature cycling, mechanical stresses, and vibration can result in inefficient heat transfer or failure via delamination, cracking, and voiding. To address this, researchers at Purdue University have developed a mechanically robust and self-healing copolymer thin film that can be used as a Type II thermal interface material (TIM). By incorporating highly thermally conductive functionalized nanofillers with immiscible glassy and rubber polymer phases, this solution minimizes delamination and the cycle life challenges associated with conventional thermal interface materials. This technology has applications in thermal management, particularly for semiconductors, microelectronics, and telecommunications, and would be beneficial to organizations looking to manufacture more resilient thermal interface materials.

Advantages

-Robust thermal interfaces

-Longer cycle life

-Resilient to mechanical loads

Applications

-Thermal Interface Materials (TIMs)

-Thermal management

-Semiconductor & Microelectronics packaging

Technology Validation:

This technology has been validated through in-situ testing of sample materials where thermal conductivity of > 1 W/m-K was achieved.

TRL: 4

Intellectual Property:

Keywords: Thermal interface materials, self-healing copolymer, robust thermal interfaces, Type II TIM, heat dissipation, thermal management, semiconductor packaging, microelectronics, nanofillers, long cycle life, Composite, Cooling, Heat Transfer, Materials and Manufacturing, Mechanical Engineering, microelectronics, Polymer, polymer blend, semiconductor, semiconductor packaging, thermal interface material