Flexible Hybrid Electronics for Extreme Environment (FEEE)

Extreme environments pose intense and dynamic conditions, particularly to electronic systems which are sensitive to temperature, humidity, radiation, and more. Despite the prevalence of extreme conditions across a variety of industries and applications, there have been no demonstrations of flexible electronics platforms capable of withstanding these conditions. Researchers at Purdue University have developed a platform-based approach to creating flexible electronics for extreme environments. Purdue's platform includes use of a flexible substrate and chiplets capable of withstanding extreme thermal cycle, arctic environment, high vibration, high/low G, high UV, radiation, EM, humidity, salinity and pH variation. This technology can be used to integrate physically conformable electronics in aerospace, automotive, industrial and defense applications for sensing, autonomy, and more.

Advantages

-Flexible substrate and chiplets

-Use in extreme environments

-Improved system resilience

Applications

-Flexible electronics

-Extreme Environments

-Aerospace

-Automotive

Technology Validation:

This technology is in the conceptual stages.

TRL: 2

Intellectual Property:

Keywords: Aeronautics, Conformal, Electrical Engineering, extreme environments, Flexible Electronics, Radiation, resilience, rigidity, Temperature, Thermal